Technological SMT lines

Machine equipment of technological lines SMT I, SMT II and SMT III

SMT line I
with the JUKI KE-2070L and JUKI KE-2080L automatic machines, it stands out above all for its accuracy and reliability of assembly with an output of 35,000 parts per hour.

SMT line II
with JUKI RS-1R and JUKI KE-3020VAL machines, which with their parameters significantly expand the possibilities for mounting SMD components, both in terms of their range and performance. The total output of the assembly line is therefore 51,900 parts per hour.

SMT line III
with the JUKI KE-1080 automatic machine, is intended for small-volume orders in order to lighten and streamline the operation of the two main technological lines SMT I and SMT II. The total output of the assembly line is 14,100 parts per hour.

Ersa Stencil Printer - VERSAPRINT 2 ULTRA³

Stencil printer and SPI combined to highest efficiency.
The VERSAPRINT 2 ULTRA³ is the world's first stencil printer with fully integrated 100 % 3D inspection.

Stencil Printer GKG JUKI GL Plus

A fully automatic stencil printer for glue and paste PCB printing with high accuracy and repeatability included in the small-volume SMT line III.

SMT machine JUKI KE-1080 L

4 heads and laser centering in flight + 1 head for mounting chips centered by camera.
Range of components from 01005 (0.4 x 0.2 mm) to 33.5 mm for laser centering and from 3 mm to 74 x 74 mm or 50 x 150 mm for camera centering.
The maximum height of the component is 25 mm
In according with IPC9850 is shouldering performance up to 14100 components per hour.
PCB size from 50 x 30 to 410 x 360 mm.
Automatic exchange of nozzles.
Electrically adjustable width conveyor according to the program.
The laser system for measuring the height of the sampling devices (HMS).
Exchangeable feeder trolleys.
Shouldering accuracy ±50 µm (laser), ± 30 μm (camera).

SMT machine JUKI KE-2070 L

6 hlav a centrování laserem za letu.
Sortiment součástek 01005 – 33,5 x 33,5 mm.
Výška součástek 6 nebo 12 mm podle nastavení.
Osazovací výkon dle IPC 9850 18300 součástek za hodinu.
Rozměr DPS 50 x 30 – 410 x 360 mm.
Automatická výměna trysek na všech hlavách.
Elektricky nastavitelná šířka dopravníku dle programu.
Laserový systém pro měření odběrní výšky součástek (HMS).
Vyměnitelné vozíky podavačů.
Přesnost osazení ±50 µm (laser).

SMT machine JUKI KE-2080 L

6 heads with laser centering in flight + single head for mounting IC.
Range of components from 01005 (0.4 x 0.2 mm) to 33.5 mm for laser centering and from 3 mm to 74 x 74 mm or 50 x 150 mm for camera centering.
The maximum height of the component is 25 mm.
In according with IPC9850 is shouldering performance up to 16700 components per hour.
PCB size from 50 x 30 to 410 x 360 mm.
Automatic exchange of nozzles.
Electrically adjustable width conveyor according to the program.
The laser system for measuring the height of the sampling devices (HMS).
Exchangeable feeder trolleys.
Shouldering accuracy ±50 µm (laser), ± 30 μm (camera).

SMT machine JUKI KE-3020VAL

6 heads and laser centering in flight / or by camera + 1 head for mounting chips centered by camera
Range of components from 01005 (0.4 x 0.2 mm) to 33.5 mm for laser centering and from 3 mm to 74 x 74 mm or 50 x 150 mm for camera centering.
The maximum height of the component is 25 mm
In according with IPC9850 is shouldering performance up to 17 100 components per hour.
PCB size from 50 x 30 to 410 x 360 mm.
Automatic exchange of nozzles.
Electrically adjustable width conveyor according to the program.
The laser system for measuring the height of the sampling devices (HMS).
Exchangeable feeder trolleys.
Shouldering accuracy ±50 µm (laser), ± 30 μm (camera).

SMT machine JUKI RS-1R

8 heads and laser centering in flight / or by camera
Range of components from 009005 (0,3 x 0,15 mm) to 74 x 74 mm for square shaped components or 50 x 150 mm for rectangular components.
The maximum height of the component is 25 mm
In according with IPC9850 is shouldering performance up to 29 000 components per hour.
PCB size from 50 x 50 to 650 x 370 mm.
Automatic exchange of nozzles.
Electrically adjustable width conveyor according to the program.
The laser system for measuring the height of the sampling devices (HMS).
Exchangeable feeder trolleys.
Shouldering accuracy ±35 µm.

JUKI matrix tray changer

The JUKI TR6SNR and JUKI TR6SNV matrix tray changers allow to feed components with dimensions from 5 to 50 mm into the assembly machine, with BGA or other shaped housings, which are stored in the tray on several pallets on top of each other.

Turn Conveyor e-FLEX WHM

Due to the limited space availability of the technological SMT line III, the rotary conveyor redirects the flow of mounted PCBs by 90 degrees without operator intervention.
This device has the ability to save programs for individual products. This is mainly about setting the width of the conveyor. The operator of the line controls the device using a touch screen.

Loader e-FLEX WHM

Loader e-FLEX WHM loads PCBs to the SMT line.
This device has the ability to save programs for individual products. This is mainly about setting the width of the conveyor and the height of placing the PCB in the magazine with regard to the height of the installed components. The operator of the line controls the device using a touch screen.

Loader SAMSUNG LD-100E

Loader loads PCBs to the SMT line.

Unloader e-FLEX WHM

The unloader e-FLEX WHM unloads PCBs from the SMT line into the magazine, specifically from the reflow oven.
This device has the ability to save programs for individual products. This is mainly about setting the width of the conveyor and the height of placing the PCB in the magazine with regard to the height of the installed components. The operator of the line controls the device using a touch screen.

Unloader SAMSUNG UL-100E

Unloader unloads PCBs from the end of SMT line - reflow oven - to the magazine.

Reflow Oven HELLER 1707 EXL

Reflow owen HELLER 1707 EXL is a convection remelting furnace for remelting solder paste or curing glue.
The temperature in zones is operated by computer which gains an acces to temperature adjustment in order to ensure the almost ideal temperature profile.

Reflow Oven HELLER 1707 MK5

HELLER 1707 MK5 is a newer model of convection reflow oven for remelting solder paste or curing glue. The temperature in zones is operated by computer which gains an acces to temperature adjustment in order to ensure the almost ideal temperature profile for both lead and lead-free solder pastes.