Technological SMT lines

Technological line SMT I

Line SMT I utilizes machine JUKI KE-2080 L and a JUKI KE-1080L, which replaced machines TOPAZ. Line excels in its accuracy and reliability with the performance of 30 800 components per hour.

Technological line SMT II

Line II utilizes machine JUKI KE-2070L a JUKI KE-3020VAL, whose parameters significantly expand the capabilities for shouldering of SMD components, both in terms of their range, and mounting capacity. The overall capacity of the mounting line is 39 200 components per hour.

Stencil Printer GKG JUKI GL Plus

A fully automatic stencil printer for glue and paste PCB printing with high accuracy and repeatability.
We purchased these modern stencil printers for both of our assembly lines in order to replace our obsolete and unreliable machines.

SMT machine JUKI KE-1080 L

4 heads and laser centering in flight + 1 head for mounting chips centered by camera.
Range of components from 01005 (0.4x0.2mm) to 33.5mm for laser centering and from 3 mm to 74 x 74 mm or 50 x 150 mm for camera centering.
The maximum height of the component is 25mm
In according with IPC9850 is shouldering performance up to 14100 components per hour.
PCB size from 50x30 to 410x360mm.
Automatic exchange of nozzles.
Electrically adjustable width conveyor according to the program.
The laser system for measuring the height of the sampling devices (HMS).
Exchangeable feeder trolleys.
Shouldering accuracy ±50 µm (laser), ± 30μm(camera).

SMT machine JUKI KE-2070 L

6 heads and laser centering in flight.
Range of components 01005 - 33.5 x 33.5 mm.
Height of parts 6 or 12 mm depending on the setting.
Shouldering performance 18300 components per hour (according to norm IPC 9850).
PCB size from 50x30 to 410x360mm.
Automatic exchange of nozzles on all heads.
The laser system for measuring the height of devices (HMS).
Interchangeable trucks of feeders.
Shouldering accuracy ± 50μm (laser).

SMT machine JUKI KE-2080 L

6 heads with laser centering in flight + single head for mounting IC.
Range of components from 01005 (0.4x0.2mm) to 33.5mm for laser centering and from 3 mm to 74 x 74 mm or 50 x 150 mm for camera centering.
The maximum height of the component is 25mm.
In according with IPC9850 is shouldering performance up to 16700 components per hour.
PCB size from 50x30 to 410x360mm.
Automatic exchange of nozzles.
Electrically adjustable width conveyor according to the program.
The laser system for measuring the height of the sampling devices (HMS).
Exchangeable feeder trolleys.
Shouldering accuracy ± 30μm.

SMT machine JUKI KE-3020VAL

6 heads and laser centering in flight/or by camera + 1 head for mounting chips centered by camera
Range of components from 01005 (0.4x0.2mm) to 33.5mm for laser centering and from 3 mm to 74 x 74 mm or 50 x 150 mm for camera centering.
The maximum height of the component is 25mm
In according with IPC9850 is shouldering performance up to 20 900 components per hour.
PCB size from 50x30 to 410x360mm.
Automatic exchange of nozzles.
Electrically adjustable width conveyor according to the program.
The laser system for measuring the height of the sampling devices (HMS).
Exchangeable feeder trolleys.
Shouldering accuracy ±50 µm (laser), ± 30μm(camera).

Loader SAMSUNG LD-100E

Loader loads PCBs to the SMT line.
Communicates via SMEMA interface.

Unloader SAMSUNG UL-100E

Unloader unloads PCBs from the end of SMT line - reflow oven- to the magazine.
Communicates via SMEMA interface.

Inspection Conveyers

The LS-E100HD3BXL and WH-C070HD3BXL inspection conveyors allow the board to be suspended and checked before entering the reflow oven.

Reflow Oven HELLER 1707 EXL

Reflow owen HELLER 1707 EXL is a convection remelting furnace for remelting solder paste or curing glue.
The temperature in zones is operated by computer which gains an acces to temperature adjustment in order to ensure the almost ideal temperature profile.