Technological SMT lines

Technological line SMT I, SMT II and SMT III

Line SMT I utilizes machine JUKI KE-2070 L and a JUKI KE-2080L. Line excels in its accuracy and reliability with the performance of 35000 components per hour.

Line SMT II utilizes machine JUKI RS-1R a JUKI KE-3020VAL, whose parameters significantly expand the capabilities for shouldering of SMD components, both in terms of their range, and mounting capacity. The overall capacity of the mounting line is 51900 components per hour.

Stencil Printer GKG JUKI GL Plus

A fully automatic stencil printer for glue and paste PCB printing with high accuracy and repeatability.
We purchased these modern stencil printers for both of our assembly lines in order to replace our obsolete and unreliable machines.

SMT machine JUKI KE-1080 L

4 heads and laser centering in flight + 1 head for mounting chips centered by camera.
Range of components from 01005 (0.4 x 0.2 mm) to 33.5 mm for laser centering and from 3 mm to 74 x 74 mm or 50 x 150 mm for camera centering.
The maximum height of the component is 25 mm
In according with IPC9850 is shouldering performance up to 14100 components per hour.
PCB size from 50 x 30 to 410 x 360 mm.
Automatic exchange of nozzles.
Electrically adjustable width conveyor according to the program.
The laser system for measuring the height of the sampling devices (HMS).
Exchangeable feeder trolleys.
Shouldering accuracy ±50 µm (laser), ± 30 μm (camera).

SMT machine JUKI KE-2070 L

6 heads and laser centering in flight.
Range of components 01005 - 33.5 x 33.5 mm.
Height of parts 6 or 12 mm depending on the setting.
Shouldering performance 18300 components per hour (according to norm IPC 9850).
PCB size from 50 x 30 to 410 x 360 mm.
Automatic exchange of nozzles on all heads.
The laser system for measuring the height of devices (HMS).
Interchangeable trucks of feeders.
Shouldering accuracy ± 50 μm (laser).

SMT machine JUKI KE-2080 L

6 heads with laser centering in flight + single head for mounting IC.
Range of components from 01005 (0.4 x 0.2 mm) to 33.5 mm for laser centering and from 3 mm to 74 x 74 mm or 50 x 150 mm for camera centering.
The maximum height of the component is 25 mm.
In according with IPC9850 is shouldering performance up to 16700 components per hour.
PCB size from 50 x 30 to 410 x 360 mm.
Automatic exchange of nozzles.
Electrically adjustable width conveyor according to the program.
The laser system for measuring the height of the sampling devices (HMS).
Exchangeable feeder trolleys.
Shouldering accuracy ±50 µm (laser), ± 30 μm (camera).

SMT machine JUKI KE-3020VAL

6 heads and laser centering in flight / or by camera + 1 head for mounting chips centered by camera
Range of components from 01005 (0.4 x 0.2 mm) to 33.5 mm for laser centering and from 3 mm to 74 x 74 mm or 50 x 150 mm for camera centering.
The maximum height of the component is 25 mm
In according with IPC9850 is shouldering performance up to 17 100 components per hour.
PCB size from 50 x 30 to 410 x 360 mm.
Automatic exchange of nozzles.
Electrically adjustable width conveyor according to the program.
The laser system for measuring the height of the sampling devices (HMS).
Exchangeable feeder trolleys.
Shouldering accuracy ±50 µm (laser), ± 30 μm (camera).

SMT machine JUKI RS-1R

8 heads and laser centering in flight / or by camera
Range of components from 009005 (0,3 x 0,15 mm) to 74 x 74 mm for square shaped components or 50 x 150 mm for rectangular components.
The maximum height of the component is 25 mm
In according with IPC9850 is shouldering performance up to 29 000 components per hour.
PCB size from 50 x 50 to 650 x 370 mm.
Automatic exchange of nozzles.
Electrically adjustable width conveyor according to the program.
The laser system for measuring the height of the sampling devices (HMS).
Exchangeable feeder trolleys.
Shouldering accuracy ±35 µm.

JUKI matrix tray changer

The JUKI TR6SNR and JUKI TR6SNV matrix tray changers allow to feed components with dimensions from 5 to 50 mm into the assembly machine, with BGA or other shaped housings, which are stored in the tray on several pallets on top of each other.

Loader SAMSUNG LD-100E

Loader loads PCBs to the SMT line.
Communicates via SMEMA interface.

Unloader SAMSUNG UL-100E

Unloader unloads PCBs from the end of SMT line - reflow oven- to the magazine.
Communicates via SMEMA interface.

Reflow Oven HELLER 1707 EXL

Reflow owen HELLER 1707 EXL is a convection remelting furnace for remelting solder paste or curing glue.
The temperature in zones is operated by computer which gains an acces to temperature adjustment in order to ensure the almost ideal temperature profile.