We have invested in a several solutions to meet THT (Through-hole technology) requirement from single sided THT assemblies to complex high mix SMT and THT assemblies.
The manufacturing requiring Through Hole Assembly Services is done at workplaces for shaping and manual mounting of PCBs while respecting the fundamental principles for an antistatic workplace. Our facility has the capability to meet your exact requirements for large or small, high density multilayer printed circuit boards or miniature hand-soldered assemblies. Our wave soldering system is completely equipped with every feature and subsystem necessary to achieve the most exacting requirements of multi-layer fine line printed circuit board soldering.
Our extensive experience enables us to routinely solder dense circuits, difficult line geometrics, large lands and odd-shaped printed circuit boards without icicles, bridges, or solder build-up. All variables, such as pre-bake duration and temperature, flux application, density of pre-heat, solder temperature, height of wave, entry angle, and conveyer speed are precisely programmed and controlled to repeatedly obtain a maximum degree of solder quality.
We are able to solder the products using both leaded and unleaded technologies.